| PART |
Description |
Maker |
| LH1524 LH1505 LH1522 LH1520 LH1531 LH1532 LH1544 |
Device is not Implied at these or any Other conditions in Excess DUAL TRANSISTOR OUTPUT SOLID STATE RELAY, 5300 V ISOLATION-MAX
|
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
|
| PIC16C63-I/SPREL PIC16C63T-04/SO PIC16C63T-04E/SO |
A newer version of this device is available. Please consider PIC16C63A
This powerful (200 nanosecond instruction execution) yet easy-to-program (only 35 single word instructions) CMOS OTP-based 8-bit ...
A newer version of this device is available. Please consider PIC16C65B
A newer version of this device is available. Please consider PIC16C62B
|
Microchip
|
| TMPR28051 TMPR28051-3-SL5 |
TMPR28051 STS-1/AU-3 (STM-0) Mapper Device Advisory for Version 5 of the Device
|
AGERE[Agere Systems]
|
| EP4SGX180DF29I3N EP4SGX360KF40C4N |
Stratix IV Device Handbook Volume 4: Device Datasheet and Addendum
Device Datasheet and Addendum for Stratix IV Devices
|
Altera Corporation
|
| MC9S12DT256C MC9S12DT256B MC9S12DG256C 9S12DP256BD |
9S12Dx256B Device Guide. also covers C derivatives and 9S12Ax256 devices
device made up of standard HCS12 blocks and the HCS12 processor core 设备组成水平的HCS12块和HCS12的处理器核心
|
ETC
飞思卡尔半导体(中国)有限公司
|
| MC9S12DJ64MFU MC9S12DJ64VFU 9S12D32DGV1 S12BDLCV1D |
MC9S12DJ64 Device User Guide V01.17 16-BIT, FLASH, 25 MHz, MICROCONTROLLER, PQFP80
9S12DGDJ64DGV1 Device Guide. also covers 9S12D64. 9S12A64. 9S12D32. and 9S12A32 devices 9S12DGDJ64DGV1设备指南。也包括9S12D649S12A649S12D32。和9S12A32设备
|
Motorola Mobility Holdings, Inc.
HIROSE ELECTRIC Co., Ltd.
Freescale Semiconductor, Inc
|
| AK49064SP-10 AK44064SP-10 AK44256SN-12 AK411024SRM |
64K X 9 MULTI DEVICE DRAM MODULE, 100 ns, SMA30
64K X 4 MULTI DEVICE DRAM MODULE, 100 ns, SMA22
256K X 4 MULTI DEVICE DRAM MODULE, 120 ns, SMA22
1M X 1 MULTI DEVICE DRAM MODULE, 150 ns, SMA22
128K X 1 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
64K X 2 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
|
|
| MF799ST MF799 |
0.5V WDM duplex device, for datacom, telecom and general purpose applications
Datacom, Video Link, Intra-Office Telecom, WDM(Wavelength Division Multiplex) Duplex Device(用于数据通信，视频连接，内部办公通信，波长多路复用（WDM）的双工设备)
Datacom, Video Link, Intra-Office Telecom, WDM Duplex Device
|
MITEL[Mitel Networks Corporation]
Mitel Semiconductor
|
| ALD1108E ALD1108EDC ALD1108EPC ALD1108ESC ALD1110E |
QUAD/DUAL EPADPRECISION MATCHED PAIR N-CHANNEL MOSFET ARRAY
QUAD/DUAL ELECTRICALLY PROGRAMMABLE ANALOG DEVICE (EPAD⑩)
QUAD/DUAL ELECTRICALLY PROGRAMMABLE ANALOG DEVICE (EPAD)
QUAD/DUAL ELECTRICALLY PROGRAMMABLE ANALOG DEVICE (EPAD?
QUAD/DUAL ELECTRICALLY PROGRAMMABLE ANALOG DEVICE (EPAD 双电可编程模拟器件（EPAD⑩）
|
ALD[Advanced Linear Devices]
Advanced Linear Devices, Inc.
|
| 2249-C-48 2249-E-240 2249-C-12 2249-C-96 2249-K-12 |
Pomona Stress Relieved/BNCCable Assemblies, Color: Black, Length: 48 , Contact Plating: Nickel, Contact Material: Brass, Features: BNC to BNC, weatherproof molded construction, ideal for use with test instruments INTERCONNECTION DEVICE
Connector assemblies, RF Test; Connector Type A:BNC Male; Connector Type B:BNC Male; Cable Length:20ft; Approval Bodies:CE; Body Material:Brass; Contact Material:Brass; Features:75 Ohm impedance; For Use With:RG59B/U INTERCONNECTION DEVICE
Connector assemblies, RF Test; Connector Type A:BNC Male; Connector Type B:BNC Male; Cable Length:1ft; Approval Bodies:CE; Body Material:Brass; Contact Material:Brass; For Use With:RG58C/U; Leaded Process Compatible:Yes INTERCONNECTION DEVICE
Connector; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes INTERCONNECTION DEVICE
BNC (M), RG174/U INTERCONNECTION DEVICE
BNC (M) RG223/U RoHS Compliant: Yes INTERCONNECTION DEVICE
TEST , 50R RG58 2M
|
Pomona Electronics
|
